In electronic boards, such as PCBs or printed circuit boards, they are used to mechanically support electronic components that have their soldered connections welded to the top of the copper pad in flat-mount applications. These electronic components will be punched into the electronics board and copper pads to solder the component terminals in through-hole applications.
An electronic board design may have all of the components of the hole in the top or side of the component, a mixture of mounting through the hole and surface only on the upper side, a mixture of components mounting in the hole and surface mounting components in the bottom or side of the circuit, or surface mounting components on the upper and lower sides of the board.
PCBA design plates are also used to electrically connect the conductors required for each component using copper conductive traces. The component fillings and connection traces are fixed from coated copper sheets on a non-conductive substrate.
Printed circuit boards or PCBA are designed as single-sided with fillings and traces of copper on one side of the board only, two-sided with cushions and traces of copper on the top and bottom of the board or multilayer designs with copper pads and dashes in the top and bottom of the board with a variable number of internal copper layers with strokes and connections.
A nonconductive base is used to fix the traces of the components with the copper sheets. A PCBA can be composed in several ways. They could be one side with copper fillings on one side of the base. Conductive copper traces can be connected through electrical wires using PCBs. They may also have copper plots in the upper and lower layers. In the third option can be multilayered with traces of copper on all internal sides as well.
A core dielectric material is found in single or double plates. They consist of FR-4 epoxy fiberglass, with copper coating on one or both sides. When the board is in the process of manufacturing, the copper plate is assembled to form actual copper pads. In a multilayer plate, there are layers of dielectric materials separated by adhesives and these layers, in turn, separate the copper plates. Now, under the influence of heat and pressure, the layers are aligned. Using modern techniques, we can produce layers of several plates with more than 48 layers.